硬件工程師英文簡歷表格

學識都 人氣:5.56K

每位求職者想要贏得招聘單位的認可,首先需要展現自己獨有的競爭力,能夠依靠個人簡歷將優勢突出展現與招聘人員的面前,讓招聘單位感覺到求職者能夠勝任招聘的崗位需求。只要可以獲得招聘人員的認可,求職者獲得工作機會的概率非常高。

硬件工程師英文簡歷表格

任何企業在招聘的時候,均希望招聘到工作經驗較爲豐富的求職人員。優質的人才不僅需要具備較高的學歷水平,同時更爲難得的是豐富的經驗。具備豐富經驗的工作人員,可以在更短的時間內完成全部的工作內容,有效降低企業運行的成本。因此企業在招聘的時候,更加重視個人簡歷的工作經歷內容,任何信息均可以忽略,但是填寫工作經歷的時候必須謹慎小心。通過填寫與招聘崗位類似的工作經歷,可以達到更好的求職效果。

求職者是否具備豐富的經驗直接影響到能夠獲得滿意的.工作。實際參與競爭的時候,能夠在個人簡歷具體內容上突出個人豐富的工作經歷,可以增加招聘單位對於自己的認可程度,從而達到提高求職者競爭力的效果,幫助求職者在更短的時間內,找到滿意的工作單位。所以在寫作簡歷時就要注意了,更多相關資訊請繼續關注個人簡歷網站。

Name:本站Hukou: 
Residency:ShanghaiWork Experience: 
Current Salary: Tel: 
E-mail:
Career Objective
Desired Industry:Electronics/Semiconductor/IC ,Science/Research ,Government ,Others ,Testing, Certification
Desired Position:Senior Hardware Engineer ,Semiconductor Technology, Branch Office Manager ,Chief Representative ,Research Specialist Staff
Desired address:Shanghai ,Hongkong ,Beijing ,Taiwan ,MacaoDesired Salary:Negotiable
Work Experience
2006/06—Present***Company
 Industry: Electronics/Semiconductor/IC
Intel Flash Engineering Department Individual Contributor
Responsibilities:
I have been working in Intel Flash Assembly & Test Engineering
Department as an Individual Contributor since June of 2006.
Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. Our efforts are paid off:
1. The yield of year 2006 has been dramatically increased than that of year 2005.
2. The yield of all products, consecutively meets the goal.
3. The total amount of cost saving due to yield improvement is more than $1 million compared with year 2005. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2007.
Report Directly to: Department ManagerNumber of Subordinate: 14
Reference: Bao Powel
Achievements: Being Leader of ATE Yield team, I have been working with the team members to improve the products yield.
Our efforts are paid off:
1. The yield of year 2006 has been dramatically increased than that of year 2005.
2. The yield of all products, consecutively meets the goal.
3. The total amount of cost saving due to yield improvement is more than $1 million compared with year 2005. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2007.
2006/01—2006/05Intel(Shanghai) Technology Development Ltd. Company
 Industry: Electronics/Semiconductor/IC
Intel STTD-China Department Electronics Development Engineer
Responsibilities:
1. I had been working in STTD-China since Jan 2006 to May 2006 as a senior module engineer.
2. At that time, as a main contributor of this project, we succeeded in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one time.
Report Directly to: Hopman Mark   Number of Subordinate: 14
Reference: Bao Powel
Reason for Leaving: I was transferred to Intel(Shanghai)Products Ltd. Company due to the internal re-organization in June of 2006.
Achievements: As a main contributor of STTD-China department, I co-work with my colleagues to succeed in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one cycle.
2005/05—2006/01Nanyang University of Science & Technology
 Industry: Electronics/Semiconductor/IC
Electronics & Electrical Engineering Department Research Fellow
Responsibilities:
1. I work in Electronics & Electrical Engineering Department of Nanyang University of Science & Technology as a Research Fellow.
2. I majored at Gate Oxide Reliability Research in the duration.
Report Directly to: Professor Pey Kin Leoh 
Subordinate: 3
Reference: Patrick Low
Reason for Leaving: I completed the project which I undertook by myself, and want to do more challenging job.
Achievements: In less than one year, I made a lot of experiments and acquired the wonderful data for the project by myself.
Project Experience
2008/01—PresentAssembly NPI (New Product Introduction)
 Project Description: To introduce more products into Intel Flash Assembly factory, I join Assembly NPI team and work as the team leader. I coordinate with IE, Planner, Marketing guy and Engineer to select new product items, do demo in factory, and then qualify it.
Responsibility: I am working as NPI Team leader and coordinate all team members, define the NPI candidate, make Assembly build plan, follow up the progress.
2007/01—2007/12Marginal Electrical Boards Rescue
 Project Description: To rescue some electrical boards of testing equipment, a Task Force team was built up and led by me. We categorized each kind of board, made historical failure analysis on each kind of board and around &2.5 million dollars was saved finally.
Responsibility: Being the team leader, I took the job of data analysis, define each member's role, make program plan, coordinate each team member and follow up the progress.
2006/10—2007/05Optimization the current Test Process Order for Flash Memory
 Project Description: To simplify the current Test procedure and enhance the working efficiency, a Task Force team has been called and started by me.
Responsibility: Being the Project leader, I take the main responsibility, such as, design, plan, organize and implement.
2006/05—2006/12Test Yield of Flash memory Improvement
 Project Description: To improve the test yield of different products, a Task Force team was built up and led by me. Being the team leader, I worked with all team members to dig out the failure root cause for each product, defined action taken plan for each emergency case, coordinated each team member and make pro-active plan to avoided unexpected things happen.
Responsibility: Being the team leader of Improving Test Yield, coordinate each team member, make program plan and follow up.
Education and Training
2005/05—2006/01Nanyang University of Science & Technology Microelectronics Doctorate
 I worked in Nan yang University of Science & Technology as a Research Fellow. I major at Gate oxide Reliability research in the duration.
2004/03—2005/03Seoul National University of Korea Microelectronics Others
 I had been working in National Physical Lab of Seoul National University in Korea since March of 2004 to March of 2005 as a Post-doctor. Where I unhook the project of research & development of Carbon-Nan tube Biosensor. And only after one year, an EIS sensor based on CMOS technology has been successfully produced. And one SCI paper about it has been published in Semiconductor Science and Technology.
2001/03—2004/03Shanghai Institute of Microsystems and Information Technology,Chinese Academy of Sciences Information Technology Doctorate
1998/09—2001/03Nanjing University of Science & Technology Material Science and Engineering Master
 Being a master student of this period, I have published one EI paper about Super-fine metal power's electrical characteristics.
1993/09—1997/07Nanjing University of Science & Technology Material Science and Engineering Bachelor
1997/07—1998/07Assistant Engineer in Quality Verification Department, Boiler Factory in Zhengzhou city of Henan resistant Engineer in Quality Verification Department
Professional Skills
Language Skills:English: EXCELLENT
Korean: AVERAGE
Computer Skills:Technology   skilled 96Month
SAP   understanding 8Month
Certificate:2000/11  MCSE
1999/06  CET6
Self-appraisal
7 years working experience of Semiconductor Industry and where 2 years overseas working/study experience. Smart working, innovation thinking and very talented creative working model.