| Failure analysis capability: 1. Experienced in failure analysis on PC structure based PCBA. Good at the common debug skills/method of electronic circuit. 2. Experienced in system level test of silicon components, can provide basic chip level analysis on silicon component. Project/Task management: 1. Have a good understanding of the cosumer electronic product manufacturing/testing process in OEM/ODM factory. Be very familiar with the function test process, which including the operation of the products, the test data query structures (SFCS system), etc. This will ensure that I can make good plans to solve the problems happen during the lifecycle of a product. 2. Able to be involved in End to End project. Had been involved in delivering 3 ODM and 2 OEM products in my first company. 3. Now keep a task management system for the purpose of following up each task/project. This will help to deliver the task in time and with good quality. 4. Have the sence of engineering excellence. with the plan to improve technical and soft skill during working. Now focus on electrical industry standards. Six Sigma management, Data Analysis and DOE capability: 1. Got the ceritification on Six Sigma Green Belt in 2006. Delivered a Six Sigma Green Belt project in 2006, which is about reducing function test cost of a consumer electronic product. 2. Received basic DOE training. As a result of Six Sigma and DOE training, have the capability of statistical analysis on datas of test, manufacturing, etc., which will help on failure analysis and planning. |